(kicad_pcb
	(version 20260206)
	(generator "pcbnew")
	(generator_version "10.0")
	(general
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		(legacy_teardrops no)
	)
	(paper "A4")
	(layers
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		(4 "In1.Cu" power)
		(6 "In2.Cu" signal)
		(2 "B.Cu" signal)
		(9 "F.Adhes" user "F.Adhesive")
		(11 "B.Adhes" user "B.Adhesive")
		(13 "F.Paste" user)
		(15 "B.Paste" user)
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		(7 "B.SilkS" user "B.Silkscreen")
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		(3 "B.Mask" user)
		(17 "Dwgs.User" user "User.Drawings")
		(19 "Cmts.User" user "User.Comments")
		(21 "Eco1.User" user "User.Eco1")
		(23 "Eco2.User" user "User.Eco2")
		(25 "Edge.Cuts" user)
		(27 "Margin" user)
		(31 "F.CrtYd" user "F.Courtyard")
		(29 "B.CrtYd" user "B.Courtyard")
		(35 "F.Fab" user)
		(33 "B.Fab" user)
		(39 "User.1" user)
		(41 "User.2" user)
		(43 "User.3" user)
		(45 "User.4" user)
	)
	(setup
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			(layer "F.Paste" (type "Top Solder Paste"))
			(layer "F.Mask" (type "Top Solder Mask") (thickness 0.01))
			(layer "F.Cu" (type "copper") (thickness 0.035))
			(layer "dielectric 1" (type "prepreg") (thickness 0.2104) (material "7628") (epsilon_r 4.4) (loss_tangent 0.02))
			(layer "In1.Cu" (type "copper") (thickness 0.0152))
			(layer "dielectric 2" (type "core") (thickness 1.065) (material "FR4") (epsilon_r 4.6) (loss_tangent 0.02))
			(layer "In2.Cu" (type "copper") (thickness 0.0152))
			(layer "dielectric 3" (type "prepreg") (thickness 0.2104) (material "7628") (epsilon_r 4.4) (loss_tangent 0.02))
			(layer "B.Cu" (type "copper") (thickness 0.035))
			(layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01))
			(layer "B.Paste" (type "Bottom Solder Paste"))
			(layer "B.SilkS" (type "Bottom Silk Screen"))
			(copper_finish "ENIG")
			(dielectric_constraints no)
		)
		(pad_to_mask_clearance 0)
		(allow_soldermask_bridges_in_footprints no)
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